Acid Copper Plating is a new and unique single additive acid copper plating process which has shown to provide superior plate distribution by plating more copper in lower current density areas and reducing the copper thickness in higher current density areas. The ratio of plating thickness between high current areas and low current areas is a low 4:1. A significant advantage is reduced consumption of anodes when Ultra AC is plated at the same thickness of copper in the LCD as with other processes.
With the greater thickness in the LCD, cut-through when buffing and polishing the copper plate is virtually eliminated.
Click here for additional information on “How to Decrease Cut Through & Reduce Anode Consumption” with Brite Acid Copper Plating..
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